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638-pin lidless organic micro Pin Grid Array
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PowerNow!
Dual Dynamic Power Management*
Independent Dynamic Core Technology*
CoolCore Technology*
Multiple Low-Power States
Supported Core power states:*
- C0 Normal,
- C1 HALT State
- C1E Enhanced Stop Grant state
- C2 and C3 Stop Grant states
Supported Package power states:*
- S0, S1, S3, S4 and S5
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K10 AMD64 Mikroarchitektur
- AMD64 Technologie
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45 nm Silicon-on-Insulator (SOI) Technologie
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Befehlssatzerweiterungen:
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3DNow! und 3DNow! Erweiterungen, MMX und MMX Erweiterungen, SSE, SSE2, SSE3 und SSE4a
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Integrierter Grafikprozessor:
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- 2-way set associative
- separater 64 KB Befehlscache
- separater 64 KB Datencache
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- 16-way set associative
- gemeinsamer write-back Befehls- und Datencache ECC protected
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HyperTransport 3.0 Technology
- Ein 16 Bit Link unterstützt bis zu 1600 MHz Taktrate (3200 MT/s (Mega-Transfers per Second), 6,4 GB/s)
Integrierter Speichercontroller (On-Die Northbridge Logic)
- 144 Bit DDR3-1066 mit 533 MHz (17,0 GB/s)
- Dual-Channel Speicherinterface
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Enhanced Virus Protection
AMD Virtualisations Technology (Pacifica)
Advanced Bit Manipulation
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Multiprozessorunterstützung:
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